Leybold GmbH
Bühler Leybold Optics Alzenau GmbH
Kroenert GmbH

HELIOS family

The HELIOS sputtering tool is a flexible platform for fast, precise and fully automated thin film coatings. It specializes in high quality optical coatings featuring very low absorption and scattering. Unsurpassed optical performance is ensured by the extremely dense, smooth, stoichiometric, and amorphous layers. Ultimate precision in layer growth control is facilitated by an optical monitoring system for in-situ on-substrate measurements.

PARMS Process Technology

The deposition of metal oxides with high and low refractive indices with PARMS (Plasma Assisted Magnetron Sputtering) is achieved by combining dynamic reactive mid-frequency (MF), dual magnetron sputtering with partial pressure control, and a reactive assist process with the RF plasma source.

During each rotation, a thin sub-stoichiometric oxide layer is deposited by the selected dual magnetron and transferred to a non-absorbing oxide layer while passing the oxygen plasma of the RF source.

Extremely Stable Production

Direct on-substrate optical monitoring is performed on an intermittent mode using an arbitrarily selected substrate position on the rotating turntable. As a consequence, optical designs can be directly and quickly transferred into production. This makes the HELIOS extremely well suited for high precision production as well as rapid prototyping.


Co-sputtering enables the realization of any refractive index between the installed high and low indices. Additionally, easier designs can be made for a number of applications, such as polarizing beam splitter, by using one or more optimal intermediate indices.


  • PARMS Process Technology
  • Precisely generates filters with very thin layers
  • Filters with over 200 Layers and over 20µm thickness
  • Optimal film oxidation
  • Extremely high process stability
  • Rapid prototyping and short time to market
  • Create mixed materials with intermediate indices
  • Fast loading and unloading without breaking vacuum
  • SEMI standards compatibility
Coating technology - Plasma Assisted Reactive Magnetron Sputtering (PARMS)
- For other applications DC or HF sputtering can be installed (option)
Coating material SiO2, Nb2O5, Ta2O5, ZrO2, HfO2, Al2O3, Si3N4...
Capacity 12 (11) x 125mm ( 5”)
16 (15) x 100mm ( 4”)
12 (11) x 200mm ( 8”)
Source positions
1 Dual magnetron sputter modules (standard) Dual magnetron sputter modules (standard)
2 Dual magnetron sputter modules (standard) Dual magnetron sputter modules (standard)
3 Single magnetron sputter modules (standard) Dual magnetron sputter modules (standard)
4 RF plasma source (standard) RF plasma source (standard)
source size For 100mm (4") coating area For 200mm (8") coating area
For 150mm (6") coating area (option)
Layer Monitoring
Time control yes yes
Optical monitoring

OMS 5000

BBM (option)

OMS 5000

BBM (option)

Floor Plan Layout
System width A
System length B
System height C
5660mm (222.8 ")
3400mm (133.9 ")
2595mm (102.2 ")
7300mm (288 ")
6140mm (242 ")
2990mm (118 ")
Site Requirements
El. power
Line voltage
System weight
46 kVA
400 VAC, 50/60 Hz
3420kg (3540lbs)
110 kVA
400 VAC, 50/60 Hz
4200kg (9260lbs)